Differences in thermal expansion characteristics of sockets and integrated circuit packaging sometimes cause ICs in Dual Inline Packages to creep up in their sockets over time. In severe cases, the DIP can creep up so high that one or more pins no longer make reliable contact. This is primarily a problem with older sockets designed before the problem was well understood. When servicing, debugging or cleaning older computers, it is a good idea to gently, but firmly, push all socketed ICs back into their sockets.

Return To Index Copyright 1994-2002 by Donald Kenney.